|
| 1 |
110322100001 |
110322.100001.運算放大器 |
110322.100001.Operational Amplifier |
1100.110322.100001.運算放大器.Operational Amplifier.オペアンプ -> 192 |
110322 |
|
| 2 |
110322100010 |
110322.100010.理想運算放大器OPAMP簡介 |
110322.100010.Introduction to Ideal Operational Amplifiers OP AMP |
1100.110322.100010.理想運算放大器OPAMP簡介.Introduction to Ideal Operational Amplifiers OP AMP.理想的なオペアンプOPAMP |
110322 |
|
| 3 |
110322100020 |
110322.100020.反相組態與非反相組態放大器 |
110322.100020.Inverting and non-inverting configuration amplifiers |
1100.110322.100020.反相組態與非反相組態放大器.Inverting and non-inverting configuration amplifiers.反転構成および非反転構成アン |
110322 |
|
| 4 |
110322100030 |
110322.100030.運算放大器特性與參數 |
110322.100030.Operational amplifier characteristics and parameters |
1100.110322.100030.運算放大器特性與參數.Operational amplifier characteristics and parameters.オペアンプの特性とパラメータ -> |
110322 |
|
| 5 |
110322100040 |
110322.100040.加法器 |
110322.100040.Adder |
1100.110322.100040.加法器.Adder.加算器 -> 282 |
110322 |
|
| 6 |
110322100050 |
110322.100050.比較器 |
110322.100050.Comparators |
1100.110322.100050.比較器.Comparators.コンパレータ -> 290 |
110322 |
|
| 7 |
110322110001 |
110322.110001.基本振盪電路應用 |
110322.110001.Basic Oscillation Circuit Application |
1100.110322.110001.基本振盪電路應用.Basic Oscillation Circuit Application.基本的な發振回路アプリケーション -> 290 |
110322 |
|
| 8 |
110322110010 |
110322.110010.施密特觸發器SchmittTrigger |
110322.110010.Schmitt Trigger |
1100.110322.110010.施密特觸發器SchmittTrigger.Schmitt Trigger.シュミットトリガーシュミットトリガー -> 270 |
110322 |
|
| 9 |
110322110020 |
110322.110020.方波產生器 |
110322.110020.Square wave generator |
1100.110322.110020.方波產生器.Square wave generator.方形波發生器 -> 290 |
110322 |
|
| 10 |
110323 |
電子學運用 |
Electronics Useage |
110323.電子學運用.Electronics Useage -> 1530 |
1100 |
|
| 11 |
110323030001 |
110323.030001.電子器件和電路 |
110323.030001.Electronics and circuits |
1100.110323.030001.電子器件和電路.Electronics and circuits.電子機器と回路 -> 191 |
110323 |
|
| 12 |
110323040001 |
110323.040001.模擬電路和數字電路 |
110323.040001.Analog and digital circuits |
1100.110323.040001.模擬電路和數字電路.Analog and digital circuits.アナログ回路とデジタル回路 -> 194 |
110323 |
|
| 13 |
110323050001 |
110323.050001.控制系統 |
110323.050001.Control System |
1100.110323.050001.控制系統.Control System.制御システム -> 195 |
110323 |
|
| 14 |
110323060001 |
110323.060001.電子學運用-通信 |
110323.060001.Communication |
1100.110323.060001.電子學運用-通信.Communication.エレクトロニクスアプリケーション-通信 -> 197 |
110323 |
|
| 15 |
110323070001 |
110323.070001.電子學運用-通信工程 |
110323.070001.Communication Engineering |
1100.110323.070001.電子學運用-通信工程.Communication Engineering.エレクトロニクスアプリケーション-通信工学 -> 191 |
110323 |
|
| 16 |
110323080001 |
110323.080001.信號處理 |
110323.080001.Signal processing |
1100.110323.080001.信號處理.Signal processing.信号処理 -> 185 |
110323 |
|
| 17 |
110323090001 |
110323.090001.信號與系統 |
110323.090001.Signals and Systems |
1100.110323.090001.信號與系統.Signals and Systems.信号とシステム -> 186 |
110323 |
|
| 18 |
110323100001 |
110323.100001.計算機工程 |
110323.100001.computer engineering |
1100.110323.100001.計算機工程.computer engineering.コンピューターエンジニア -> 191 |
110323 |
|
| 19 |
110324 |
電子束物理沉積EBPVD方法 |
Electron_Beam_Physical_Vapor_Deposition_EB_PVD_Method |
110324.電子束物理沉積EBPVD方法.Electron_Beam_Physical_Vapor_Deposition_EB_PVD_Method -> 42087 |
1100 |
|
| 20 |
110324001001 |
110324.001001.電子束物理沉積EBPVD方法 |
110324.001001.Electron Beam Physical Vapor Deposition EB PVD Method |
1100.110324.001001.電子束物理沉積EBPVD方法.Electron Beam Physical Vapor Deposition EB PVD Method.電子ビーム物理蒸着EBP |
110324 |
|
| 21 |
110324001010 |
110324.001010.電子束蒸鍍原理 |
110324.001010.Principle of electron beam evaporation |
1100.110324.001010.電子束蒸鍍原理.Principle of electron beam evaporation.電子ビーム蒸發の原理 -> 451 |
110324 |
|
| 22 |
110324001020 |
110324.001020.電子束蒸鍍機原理 |
110324.001020.Principle of electron beam evaporation machine |
1100.110324.001020.電子束蒸鍍機原理.Principle of electron beam evaporation machine.電子ビーム蒸着機の原理 -> 615 |
110324 |
|
| 23 |
110324001030 |
110324.001030.電子束蒸鍍缺點 |
110324.001030.Disadvantages of electron beam evaporation |
1100.110324.001030.電子束蒸鍍缺點.Disadvantages of electron beam evaporation.電子ビーム蒸發のデメリット -> 453 |
110324 |
|
| 24 |
110324001040 |
110324.001040.e-gun原理 |
110324.001040.e-gun principle |
1100.110324.001040.e-gun原理.e-gun principle.e-gunの原理 -> 569 |
110324 |
|
| 25 |
110324001050 |
110324.001050.e-gunevaporation |
110324.001050.e-gun evaporation |
1100.110324.001050.e-gunevaporation.e-gun evaporation.e-gun蒸發 -> 472 |
110324 |
|
| 26 |
110324001060 |
110324.001060.EBeam原理 |
110324.001060.E Beam principle |
1100.110324.001060.EBeam原理.E Beam principle.Eビーム原理 -> 480 |
110324 |
|
| 27 |
110324001070 |
110324.001070.蒸鍍機操作 |
110324.001070.Evaporator operation |
1100.110324.001070.蒸鍍機操作.Evaporator operation.蒸發器の操作 -> 290 |
110324 |
|
| 28 |
110324001080 |
110324.001080.電子束物理沉積EBPVD方法-蒸鍍濺鍍比較 |
110324.001080.Evaporation sputtering comparison |
1100.110324.001080.電子束物理沉積EBPVD方法-蒸鍍濺鍍比較.Evaporation sputtering comparison.蒸着スパッタリングの比較 -> 71 |
110324 |
|
| 29 |
110324001090 |
110324.001090.電子束物理沉積EBPVD方法-蒸鍍濺鍍優缺點 |
110324.001090.Advantages and disadvantages of sputtering |
1100.110324.001090.電子束物理沉積EBPVD方法-蒸鍍濺鍍優缺點.Advantages and disadvantages of sputtering.スパッタリングの長所と短所 - |
110324 |
|
| 30 |
110324010001 |
110324.010001.氣相沉積設備 |
110324.010001.Thin film deposition equipment |
1100.110324.010001.氣相沉積設備.Thin film deposition equipment.蒸着装置 -> 2896 |
110324 |
|
| 31 |
110324010010 |
110324.010010.化學氣相沉積 |
110324.010010.Chemical vapor deposition |
1100.110324.010010.化學氣相沉積.Chemical vapor deposition.化学蒸着 -> 3042 |
110324 |
|
| 32 |
110324010020 |
110324.010020.物理氣相沉積 |
110324.010020.Physical vapor deposition |
1100.110324.010020.物理氣相沉積.Physical vapor deposition.物理的な蒸気堆積 -> 419 |
110324 |
|
| 33 |
110324010030 |
110324.010030.電漿化學氣相沉積 |
110324.010030.Plasma chemical vapor deposition |
1100.110324.010030.電漿化學氣相沉積.Plasma chemical vapor deposition.プラズマ化学蒸気堆積 -> 2553 |
110324 |
|
| 34 |
110324010040 |
110324.010040.電子束物理沉積EBPVD方法-氣相反應 |
110324.010040.Gas phase reaction |
1100.110324.010040.電子束物理沉積EBPVD方法-氣相反應.Gas phase reaction.気相反応 -> 554 |
110324 |
|
| 35 |
110324010050 |
110324.010050.CVD設備 |
110324.010050.CVD equipment |
1100.110324.010050.CVD設備.CVD equipment.CVD装置 -> 461 |
110324 |
|
| 36 |
110324010060 |
110324.010060.pecvd原理 |
110324.010060.pecvd principle |
1100.110324.010060.pecvd原理.pecvd principle.pecvdの原則 -> 277 |
110324 |
|
| 37 |
110324010070 |
110324.010070.SAMCOPECVD |
110324.010070.SAMCO PECVD |
1100.110324.010070.SAMCOPECVD.SAMCO PECVD.SAMCOPECVD -> 186 |
110324 |
|
| 38 |
110324010080 |
110324.010080.pecvd機台 |
110324.010080.pecvd machine |
1100.110324.010080.pecvd機台.pecvd machine.pecvdマシン -> 552 |
110324 |
|
| 39 |
110324010090 |
110324.010090.物理氣相沉積化學氣相沉積比較 |
110324.010090.Comparison of physical vapor deposition and chemical vapor deposition |
1100.110324.010090.物理氣相沉積化學氣相沉積比較.Comparison of physical vapor deposition and chemical vapor deposit |
110324 |
|
| 40 |
110324010100 |
110324.010100.cvdpvd比較 |
110324.010100.cvd pvd comparison |
1100.110324.010100.cvdpvd比較.cvd pvd comparison.cvdpvd比較 -> 481 |
110324 |
|
| 41 |
110324020001 |
110324.020001.真空蒸鍍 |
110324.020001.Vacuum Vapor Deposition / Vacuum Deposition Plating |
1100.110324.020001.真空蒸鍍.Vacuum Vapor Deposition / Vacuum Deposition Plating.真空蒸着/真空蒸着メッキ -> 1722 |
110324 |
|
| 42 |
110324020010 |
110324.020010.蒸機操作 |
110324.020010.Steamer operation |
1100.110324.020010.蒸機操作.Steamer operation.蒸鍍機操作 -> 513 |
110324 |
|
| 43 |
110324020020 |
110324.020020.真空鍍膜設備 |
110324.020020.Vacuum coating equipment |
1100.110324.020020.真空鍍膜設備.Vacuum coating equipment.Vacuumcoatingequipment -> 554 |
110324 |
|
| 44 |
110324020030 |
110324.020030.高溫真空烘烤裝置 |
110324.020030.High temperature vacuum baking device |
1100.110324.020030.高溫真空烘烤裝置.High temperature vacuum baking device.高温真空ベーキング装置 -> 483 |
110324 |
|
| 45 |
110324020040 |
110324.020040.高真空氣相沉積設備 |
110324.020040.High vacuum vapor deposition equipment |
1100.110324.020040.高真空氣相沉積設備.High vacuum vapor deposition equipment.高真空蒸着装置 -> 668 |
110324 |
|
| 46 |
110324020050 |
110324.020050.MPVAP高性能真空氣相沉積設備- |
110324.020050.MPVAP high-performance vacuum vapor deposition equipment- |
1100.110324.020050.MPVAP高性能真空氣相沉積設備-.MPVAP high-performance vacuum vapor deposition equipment-.MPVAP |
110324 |
|
| 47 |
110324020051 |
110324.020051.MPVAP-粉末金屬粉末沉積設備- |
110324.020051.MPVAP-Powder metal powder deposition equipment- |
1100.110324.020051.MPVAP-粉末金屬粉末沉積設備-.MPVAP-Powder metal powder deposition equipment-.MPVAP-粉末金属粉末堆積装 |
110324 |
|
| 48 |
110324020060 |
110324.020060.普通會員名單-一般社團法人日本真空工業協會 |
110324.020060.List of ordinary members-Japan Vacuum Industry Association |
1100.110324.020060.普通會員名單-一般社團法人日本真空工業協會.List of ordinary members-Japan Vacuum Industry Association. |
110324 |
|
| 49 |
110324020070 |
110324.020070.氣相沉積設備和真空設備 |
110324.020070.Vapor deposition equipment and vacuum equipment |
1100.110324.020070.氣相沉積設備和真空設備.Vapor deposition equipment and vacuum equipment.蒸着装置＆バキューム装置 -> 554 |
110324 |
|
| 50 |
110324020080 |
110324.020080.濺射真空沉積電子束和電子顯微鏡的原理和機理 |
110324.020080.The principle and mechanism of sputtering vacuum deposition electron beam and electron |
1100.110324.020080.濺射真空沉積電子束和電子顯微鏡的原理和機理.The principle and mechanism of sputtering vacuum deposition |
110324 |
|
| 51 |
110324020090 |
110324.020090.3.關於真空的基礎知識 |
110324.020090.3. Basic knowledge about vacuum |
1100.110324.020090.3.關於真空的基礎知識.3. Basic knowledge about vacuum.3.真空についての基礎 -> 656 |
110324 |
|
| 52 |
110324020100 |
110324.020100.ATV設備 |
110324.020100.ATV equipment |
1100.110324.020100.ATV設備.ATV equipment.ATV装置 -> 326 |
110324 |
|
| 53 |
110324020110 |
110324.020110.下一代蓄電池的新製造工藝浮動IJ法真空沉積法 |
110324.020110.The new manufacturing process of next-generation batteries floating IJ method vacuum d |
1100.110324.020110.下一代蓄電池的新製造工藝浮動IJ法真空沉積法.The new manufacturing process of next-generation batteries |
110324 |
|
| 54 |
110324020120 |
110324.020120.其他塗裝設備/表面處理設備產品/服務 |
110324.020120.Other coating equipment/surface treatment equipment products/services |
1100.110324.020120.其他塗裝設備/表面處理設備產品/服務.Other coating equipment/surface treatment equipment products/s |
110324 |
|
| 55 |
110324020130 |
110324.020130.真空蒸鍍/真空蒸鍍 |
110324.020130.Vacuum evaporation/vacuum evaporation |
1100.110324.020130.真空蒸鍍/真空蒸鍍.Vacuum evaporation/vacuum evaporation.真空蒸着/真空蒸着メッキ -> 576 |
110324 |
|
| 56 |
110324020140 |
110324.020140.真空氣相沉積設備 |
110324.020140.Vacuum Vapor Deposition Equipment |
1100.110324.020140.真空氣相沉積設備.Vacuum Vapor Deposition Equipment.真空蒸着装置 -> 307 |
110324 |
|
| 57 |
110324030001 |
110324.030001.氣相沉積和濺射 |
110324.030001.Thin film deposition and sputtering |
1100.110324.030001.氣相沉積和濺射.Thin film deposition and sputtering.蒸着とスパッタリング -> 1292 |
110324 |
|
| 58 |
110324030010 |
110324.030010.蒸鍍濺鍍比較 |
110324.030010.Comparison of evaporation and sputtering |
1100.110324.030010.蒸鍍濺鍍比較.Comparison of evaporation and sputtering.蒸發とスパッタリングの比較 -> 471 |
110324 |
|
| 59 |
110324030020 |
110324.030020.蒸鍍濺鍍優缺點 |
110324.030020. Advantages and disadvantages of sputtering |
1100.110324.030020.蒸鍍濺鍍優缺點. Advantages and disadvantages of sputtering._スパッタリングの長所と短所 -> 290 |
110324 |
|
| 60 |
110324030030 |
110324.030030.什麼是濺射 |
110324.030030.What is sputtering? |
1100.110324.030030.什麼是濺射.What is sputtering?.スパッタリングとは -> 292 |
110324 |
|
| 61 |
110324030040 |
110324.030040.自製濺射裝置 |
110324.030040.Sputtering device self-made |
1100.110324.030040.自製濺射裝置.Sputtering device self-made.スパッタリング装置自作 -> 237 |
110324 |
|
| 62 |
110324030050 |
110324.030050.濺射設備ULVAC |
110324.030050.Sputtering equipment ULVAC |
1100.110324.030050.濺射設備ULVAC.Sputtering equipment ULVAC.スパッタリング装置アルバック -> 246 |
110324 |
|
| 63 |
110324030060 |
110324.030060.濺射裝置英文 |
110324.030060.Sputtering equipment English |
1100.110324.030060.濺射裝置英文.Sputtering equipment English.スパッタリング装置英語 -> 350 |
110324 |
|
| 64 |
110324040001 |
110324.040001.濺射裝置 |
110324.040001.Sputtering equipment |
1100.110324.040001.濺射裝置.Sputtering equipment.スパッタリング装置 -> 1400 |
110324 |
|
| 65 |
110324040010 |
110324.040010.濺射設備 |
110324.040010.Sputtering equipment |
1100.110324.040010.濺射設備.Sputtering equipment.スパッタリング蒸着装置 -> 290 |
110324 |
|
| 66 |
110324040020 |
110324.040020.濺射設備製造商 |
110324.040020.Sputtering equipment manufacturer |
1100.110324.040020.濺射設備製造商.Sputtering equipment manufacturer.スパッタリング装置メーカー -> 292 |
110324 |
|
| 67 |
110324040030 |
110324.040030.濺射設備份額 |
110324.040030.Sputtering equipment share |
1100.110324.040030.濺射設備份額.Sputtering equipment share.スパッタリング装置シェア -> 239 |
110324 |
|
| 68 |
110324040040 |
110324.040040.濺射裝置原理 |
110324.040040.Sputtering equipment principle |
1100.110324.040040.濺射裝置原理.Sputtering equipment principle.スパッタリング装置原理 -> 288 |
110324 |
|
| 69 |
110324040050 |
110324.040050.濺射設備價格 |
110324.040050.Sputtering equipment price |
1100.110324.040050.濺射設備價格.Sputtering equipment price.スパッタリング装置価格 -> 287 |
110324 |
|
| 70 |
110324040060 |
110324.040060.濺射方法 |
110324.040060.Sputtering method |
1100.110324.040060.濺射方法.Sputtering method.スパッタリングやり方 -> 285 |
110324 |
|
| 71 |
110324040070 |
110324.040070.飛濺汽相沉積 |
110324.040070.Sputter vapor deposition |
1100.110324.040070.飛濺汽相沉積.Sputter vapor deposition.スパッタ蒸着 -> 224 |
110324 |
|
| 72 |
110324050001 |
110324.050001.濺射式薄膜沉積設備 |
110324.050001.Sputtering thin film film forming equipment |
1100.110324.050001.濺射式薄膜沉積設備.Sputtering thin film film forming equipment.スパッタリング式薄膜成膜装置 -> 1162 |
110324 |
|
| 73 |
110324050010 |
110324.050010.薄膜技術 |
110324.050010.Thin film technology |
1100.110324.050010.薄膜技術.Thin film technology.薄膜技術 -> 281 |
110324 |
|
| 74 |
110324050020 |
110324.050020.PVD成膜設備 |
110324.050020.PVD film deposition equipment |
1100.110324.050020.PVD成膜設備.PVD film deposition equipment.PVDの成膜装置 -> 290 |
110324 |
|
| 75 |
110324050030 |
110324.050030.關於真空成膜設備的機理 |
110324.050030.About the mechanism of the vacuum film deposition equipment |
1100.110324.050030.關於真空成膜設備的機理.About the mechanism of the vacuum film deposition equipment.真空成膜装置のしく |
110324 |
|
| 76 |
110324050040 |
110324.050040.成膜設備目錄--AlbacKiko |
110324.050040.Film formation equipment catalog --ULVAC Kiko |
1100.110324.050040.成膜設備目錄--AlbacKiko.Film formation equipment catalog --ULVAC Kiko.成膜装置カタログ-アルバック機工 |
110324 |
|
| 77 |
110324050050 |
110324.050050.電子槍原理 |
110324.050050.e-gun principle |
1100.110324.050050.電子槍原理.e-gun principle.e-gun原理 -> 285 |
110324 |
|
| 78 |
110324050060 |
110324.050060.上面的電子槍 |
110324.050060.e-gun evaporation |
1100.110324.050060.上面的電子槍.e-gun evaporation.e-gunevaporation -> 374 |
110324 |
|
| 79 |
110324050070 |
110324.050070.飛濺技術的基礎 |
110324.050070.Basics of sputtering technology |
1100.110324.050070.飛濺技術的基礎.Basics of sputtering technology.スパッタ技術の基礎 -> 290 |
110324 |
|
| 80 |
110324050080 |
110324.050080.濺射法ITO膜 |
110324.050080.ITO film by sputtering method |
1100.110324.050080.濺射法ITO膜.ITO film by sputtering method.スパッタリング法によるITO膜 -> 285 |
110324 |
|
| 81 |
110324050090 |
110324.050090.通過濺射和氣相沉積製造薄膜 |
110324.050090.Thin film production by sputtering and thin film deposition |
1100.110324.050090.通過濺射和氣相沉積製造薄膜.Thin film production by sputtering and thin film deposition.スパッタリング |
110324 |
|
| 82 |
110324050100 |
110324.050100.薄霧CVD法形成鋰離子電池正極膜的機理 |
110324.050100.Formation mechanism of lithium ion battery positive electrode thin film by mist CVD me |
1100.110324.050100.薄霧CVD法形成鋰離子電池正極膜的機理.Formation mechanism of lithium ion battery positive electrode |
110324 |
|
| 83 |
110324050110 |
110324.050110.通過噴墨法製造的薄膜全固態鋰電池 |
110324.050110.Thin-film all-solid-state lithium battery manufactured by the inkjet method .. |
1100.110324.050110.通過噴墨法製造的薄膜全固態鋰電池.Thin-film all-solid-state lithium battery manufactured by the in |
110324 |
|
| 84 |
110324050120 |
110324.050120.真空氣相沉積材料 |
110324.050120.Vacuum-deposited material |
1100.110324.050120.真空氣相沉積材料.Vacuum-deposited material.真空蒸着材料 -> 554 |
110324 |
|
| 85 |
110324060001 |
110324.060001.阿爾巴克技術 |
110324.060001.VLVAC techno |
1100.110324.060001.阿爾巴克技術.VLVAC techno.アルバックテクノ -> 523 |
110324 |
|
| 86 |
110324060010 |
110324.060010.有機EL氣相沉積製造設備的最新技術 |
110324.060010.State-of-the-art technology for organic EL vapor deposition manufacturing equipment |
1100.110324.060010.有機EL氣相沉積製造設備的最新技術.State-of-the-art technology for organic EL vapor deposition man |
110324 |
|
| 87 |
110324060020 |
110324.060020.有機器件的薄膜電極沉積技術研究 |
110324.060020.Research on thin film electrode deposition technology for organic devices |
1100.110324.060020.有機器件的薄膜電極沉積技術研究.Research on thin film electrode deposition technology for organic |
110324 |
|
| 88 |
110324060030 |
110324.060030.氣相沉積材料|高純度稀有金屬綜合製造商 |
110324.060030.Thin-film deposition materials | Comprehensive manufacturer of high-purity rare metals |
1100.110324.060030.氣相沉積材料|高純度稀有金屬綜合製造商.Thin-film deposition materials | Comprehensive manufacturer o |
110324 |
|
| 89 |
110324060040 |
110324.060040.氣相沉積材料的開發 |
110324.060040.Development of thin-film deposition materials |
1100.110324.060040.氣相沉積材料的開發.Development of thin-film deposition materials.蒸着材料の開發 -> 319 |
110324 |
|
| 90 |
110324060050 |
110324.060050.氣相沉積設備的消耗零件/稀有金屬有色金屬加工製造商... |
110324.060050.Consumable parts for vapor deposition equipment / Rare metal non-ferrous metal process |
1100.110324.060050.氣相沉積設備的消耗零件/稀有金屬有色金屬加工製造商....Consumable parts for vapor deposition equipment / Ra |
110324 |
|
| 91 |
110324060060 |
110324.060060.氣相沉積設備製造商 |
110324.060060.Thin film deposition equipment manufacturer |
1100.110324.060060.氣相沉積設備製造商.Thin film deposition equipment manufacturer.蒸着装置メーカー -> 291 |
110324 |
|
| 92 |
110324060070 |
110324.060070.關於真空蒸鍍設備和真空加熱機構大學和公共機構以 |
110324.060070.Regarding vacuum vapor deposition equipment and vacuum heating mechanism universities |
1100.110324.060070.關於真空蒸鍍設備和真空加熱機構大學和公共機構以.Regarding vacuum vapor deposition equipment and vacuum he |
110324 |
|
| 93 |
110324070001 |
110324.070001.半導體製造工藝 |
110324.070001.Semiconductor manufacturing process |
1100.110324.070001.半導體製造工藝.Semiconductor manufacturing process.半導体製造工程 -> 1651 |
110324 |
|
| 94 |
110324070010 |
110324.070010.半導體製造設備/真空氣相沉積設備--Semilinks |
110324.070010.Semiconductor Manufacturing Equipment / Vacuum Deposition Equipment --Semilinks |
1100.110324.070010.半導體製造設備/真空氣相沉積設備--Semilinks.Semiconductor Manufacturing Equipment / Vacuum Deposi |
110324 |
|
| 95 |
110324070020 |
110324.070020.HeleusEpurioSemiconductor芯片製造工藝採用超高純度材料... |
110324.070020.Heraeus Epurio Semiconductor chip manufacturing process using ultra-high purity materi |
1100.110324.070020.HeleusEpurioSemiconductor芯片製造工藝採用超高純度材料....Heraeus Epurio Semiconductor chip manu |
110324 |
|
| 96 |
110324070030 |
110324.070030.原子層控制多元素真空氣相沉積設備EB/電阻加熱複合氣相沉積設備。 |
110324.070030.Atomic layer control multi-element vacuum deposition equipment EB / resistance heating |
1100.110324.070030.原子層控制多元素真空氣相沉積設備EB/電阻加熱複合氣相沉積設備。.Atomic layer control multi-element vacuum deposi |
110324 |
|
| 97 |
110324070040 |
110324.070040.半導體製造工藝後處理-CKD |
110324.070040.Semiconductor manufacturing process post-process --CKD |
1100.110324.070040.半導體製造工藝後處理-CKD.Semiconductor manufacturing process post-process --CKD.半導体製造プロセス後処 |
110324 |
|
| 98 |
110324070050 |
110324.070050.半導體製造工藝預處理-CKD |
110324.070050.Semiconductor manufacturing process pre-process --CKD |
1100.110324.070050.半導體製造工藝預處理-CKD.Semiconductor manufacturing process pre-process --CKD.半導体製造工程前処理-C |
110324 |
|
| 99 |
110324070060 |
110324.070060.半導體製造中的塗層-基恩士 |
110324.070060.Coating in semiconductor manufacturing-Keyence |
1100.110324.070060.半導體製造中的塗層-基恩士.Coating in semiconductor manufacturing-Keyence.半導体製造におけるコーティング-KEYE |
110324 |
|
| 100 |
110324070070 |
110324.070070.金屬氣相沉積設備 |
110324.070070.Metal deposition equipment |
1100.110324.070070.金屬氣相沉積設備.Metal deposition equipment.金属蒸着装置 -> 273 |
110324 |
